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Packaging information,Package Power Dissipation

	Package Power Dissipation
	Reflow Soldering Temperature

PACKAGE	Number of Pins	reel	Package Size(mm)	Package Dimensions & Reference Pattern	Power Dissipation (PCB Mounted)	Taping Specifications
CL-2025	6	3000	2.0 x 2.5
LGA-4B01	4	5000	0.75 x 0.75
MSOP-10	10	1000	4.9 x 3.0
MSOP-8A	8	1000	4.9 x 3.0
MSOP-8B	8	3000	4.0 x 2.95
QFN-0601	6	3000	2.0 x 2.0
QFN-20	20	1000	4.0 x 4.0
QFN-24	24	1000	4.0 x 4.0
SMA	2	1500	5.20 x 2.79 x 2.20
SOD-123A	2	3000	3.85 x 1.7 x 1.25
SOD-323A	2	3000	2.7 x 1.4 x 1.0
SOD-523	2	3000	1.7 x 0.85 x 0.77
SOD-723	2	3000	1.5 x 0.65 x 0.65
SOP-8	8	1000	5.0 x 4.2
SOP-8FD	8	1000	6.0 x 4.9
SOT-223	3	1000	7.0 x 6.6
SOT-23	3	3000	2.8 x 2.9
SOT-23D	3	3000	3.0 x 2.85
SOT-25	5	3000	2.8 x 2.9
SOT-26	6	3000	2.8 x 2.9
SOT-26W	6	3000	2.8 x 2.9
SOT-89	3	1000	4.0 x 4.5
SOT-89-5	5	1000	4.35 x 4.5
SSOT-24	4	3000	2.1 x 2.0
SSOT-25	5	3000	2.1 x 2.0
TO-252	3	2500	9.9 x 6.55
TO-92	3	2000	14.8 x 4.65
TSSOP-16	16	3000	6.4 x 5.1
USP-10	10	3000	2.7 x 2.5
USP-10B	10	3000	2.9 x 2.6
USP-10B03	10	3000	2.5 × 2.15 x 1.05
USP-12B01	12	3000	2.8 x 2.3 x 0.6
USP-2B01	2	10000	0.6 x 0.3
USP-2B02	2	10000	0.5 x 0.8
USP-3	3	3000	1.2 x 1.2
USP-4	4	3000	1.2 x 1.6
USP-4D	4	3000	1.2 x 1.6
USP-6B	6	3000	1.8 x 2.0
USP-6B04	6	5000	1.2 x 1.2
USP-6C	6	3000	1.8 x 2.0
USP-6EL	6	3000	1.8 x 2.0
USP-8	8	3000	2.7 x 2.5
USP-8A01	8	3000	1.5 x 1.5
USPN-4	4	5000	0.9 x 1.2
USPN-4B02	4	3000	0.75 x 0.95
USPN-6	6	5000	1.3 x 1.3
USPQ-4B03	4	5000	1.0 x 1.0